LE series thermal grease has good thermal conductive performance and reliability and can wet the surface of copper and aluminum which is extremely suit for the heat transfer of the CPU, GPU and other heating power components. As LE series has low adhesion, can fully wet the surface, form very low surface thermal resistance, it can quickly transfer the heat to cooling device. Just paste the grease on the gap between the power components and cooling device to help dismiss the air gap and enlarge the heat flow, decrease thermal resistance, reduce the temperature of power components, improve reliability and extend the usage life
Typical Applications:
- Between Semiconductor and heatsink
- Between CPU and heatsink
- Between power resistor and base
- Thermoelectric cooler
- The surface of temperature regulator and assembly
- High-power LED lighting
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Physical Properties:
|
Test Item
|
Test Method
|
Unit
|
LE120
|
LE200
|
LE300
|
LE380
|
LE500
|
|
Color
|
Visual
|
-
|
White
|
White
|
Gray
|
Gray
|
Gray
|
|
Specific Gravity
|
ASTM D792
|
g/cm3
|
2.1
|
2.4
|
3.0
|
3.2
|
3.38
|
|
Continuous Use Temp
|
EN344
|
℃
|
-40~+200
|
-40~+200
|
-40~+200
|
-40~+200
|
-40~+200
|
|
Weight Loss
|
@150℃240H
|
%
|
≤1.0
|
≤1.0
|
≤0.5
|
≤0.5
|
≤0.5
|
|
Breakdown Voltage
|
ASTM D149
|
KV/mm
|
≥10
|
≥10
|
≥8
|
≥8
|
≥8
|
|
Volume Resistivity
|
ASTM D257
|
Ω·cm
|
1×1015
|
9×1012
|
1×1013
|
3×1013
|
9×1012
|
|
Dielectric Constant
|
ASTM D150
|
@1MHz
|
4.42
|
5.78
|
5.88
|
6.79
|
6.1
|
|
Dielectric Loss
|
ASTM D150
|
@1MHz
|
2.05E-03
|
6.49E-03
|
3.58E-03
|
8.13E-03
|
7.67E-03
|
|
Thermal Conductivity
|
ISO 22007-2
|
W/m·K
|
1.2
|
2.0
|
3.0
|
3.8
|
5.0
|
|
Thermal Impedance
|
ASTM D5470
|
℃-in2/W
|
0.150
|
0.050
|
0.015
|
0.012
|
0.009
|
Standard package: syringe/pot/bucket package;
30G/40G/1KG/5KG/10KG/20KG, customized specifications available;
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For more , please kindly feel free to contact rita(at)szutd.com
